XSCAN-7000

XSCAN-7000 capacity for state-of-the-art a method of construction matching function realization of high-accuracy product detect capacity materialization of high speed Know- How of automatic skill ( during 14 years) Product Info XSCAN-7000 is attachment automatic equipment. It can a fine point PCB product skill, STACK VIA, NMBI( Nero Manhattan Bump Interconnection) , Flip-Chip, BGA , etc that those are Aligh and attach. Experience a life of efficiency make product by equipment suitable for advance a method of construction. Applications ï ¿ ½ Stack via ï ¿ ½ NMBI ( Neo Manattan Bump Interconnection) ï ¿ ½ PCB for Flip-Chip ï ¿ ½ PCB for BGA Main Features ï ¿ ½ High Resolution Alignment ( 2ï ¿ ½ ) ï ¿ ½ Simulation for Re-Inspection ï ¿ ½ Statistical Product Management ï ¿ ½ Auto Calibration ï ¿ ½ Closed-Type Tube ï ¿ ½ Measurement / Analysis Software